Diamond Double Side Polishing machine

Diamond Double Side Polishing machine Feature rotary models with sophisticated control systems. This model is capable of executing complex lapping and polishing routines process while producing precise and repeatable results with a special auto-facing unit to control plate performance.

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Diamond Double Side Polishing machine Application:

• Sapphire Substrate / Wafer

• Semiconductor Wafer

• Tungsten Carbide Parts

• Ceramic Parts

• Valves

• Crystal Glass

• Oscillator Parts

technical parameter:

Items			SSP-36DPAW	SSP-50DPAW
Polishing plate	Plate material		Oxygen free Cu , Resin-Cu	Oxygen free Cu
	Plate material		Or Tin plate (*option)	or Tin plate(*option)
	Plate size		Φ910mm	Φ1240mm
	Revolution control		By inverter.	Home position.
	Plate cooling		Cooling water jacket	Cooling water jacket
Pressure plate	P. Plate		4 axles.	4 axles. (driving force system individually)
	P. Plate		4 axles.	4 axles. (driving force system individually)
	Block size		360mmΦ	485mmΦ
	Applied pressure		By cylinder	By cylinder
	Work block		-	Auto Centering
Facing unit			Mounting type.	Square type.
Capacity / batch			4 inch wafer x 24 Pcs	4 inch wafer x 40 Pcs
Capacity / batch			6 inch wafer x 12 Pcs	6 inch wafer x 24 Pcs
Utility		Electricity	AC220V, 3Phase, 60Hz	AC220V, 3Phase, 60Hz
Utility		Pneumatic	0.5~0.8 Mpa	0.5~0.8 Mpa
Etc		Machine Size	1350 2250 1920 mm	1640 3029 2575 mm
		Machine Weight	3,500Kg.	5,500Kg.
		Controller	Touch Screen (Proface)	Touch Screen (Proface)
		Signal lamp with alarm