dual-target magnetron sputtering coating machine is a cost-effective magnetron sputtering coating equipment independently developed by our company, featuring standardization, modularization, and customizability. The magnetron targets are available in 1-inch and 2-inch options, allowing customers to choose based on the size of the substrate to be coated. Equipped with two 500W DC power supplies, this machine is suitable for preparing metal films, and the two targets cater to the needs of multi-layer or multiple coating processes.
The dual-target magnetron sputtering coating machine is a cost-effective magnetron sputtering coating equipment independently developed by our company, featuring standardization, modularization, and customizability. The magnetron targets are available in 1-inch and 2-inch options, allowing customers to choose based on the size of the substrate to be coated. Equipped with two 500W DC power supplies, this machine is suitable for preparing metal films, and the two targets cater to the needs of multi-layer or multiple coating processes.
The coating machine is equipped with two high-precision mass flow controllers, and customers can customize up to four MFCs for gas paths to meet complex gas environment construction requirements. The instrument comes standard with an advanced turbo molecular pump set, capable of achieving an ultimate vacuum of 1.0E-5Pa. Additionally, other types of molecular pumps are available for selection. The gas path of the molecular pump is controlled by multiple solenoid valves, enabling the opening of the chamber and retrieval of samples without turning off the pump, significantly enhancing your work efficiency. Optionally, an all-in-one industrial control computer can be equipped to control the system, allowing for the majority of functions, such as the control of vacuum pump sets and sputtering power supplies, to be executed through computer programs, further boosting your experimental efficiency.
Application Range:
The dual-target magnetron sputtering coating machine is suitable for preparing single-layer or multi-layer ferroelectric films, conductive films, alloy films, etc. Compared to similar equipment, it boasts a wide range of applications while being compact and easy to operate, making it an ideal device for preparing material films in laboratories.
Technical Specifications:
Technical specifications of the dual-target magnetron sputtering coating machine:
Product name | Split type High Vacuum Dual-Target Magnetron Sputtering Coating Machine | |
Product model | CY-MSV325-II-DCDC-SS | |
Power supply voltage | AC220V,50Hz | |
Complete power | 6KW | |
System vacuum | ≦5×10-4Pa | |
Sample stage | Dimensions | φ150mm |
Heating temperature | ≦600℃ | |
Temperature control accuracy | ±1℃ | |
Adjustable speed | ≦20rpm | |
Magnetic target gun | Target size | Diameter Φ50.8mm, thickness ≤3mm |
Cooling mode | Circulating water cooling | |
Water flow size | Not less than 10L/Min | |
Quantity | 2 | |
Vacuum chamber | Cavity size | Diameter φ325mm, height 500mm |
Cavity material | SUU304 stainless steel | |
Observation window | Diameter φ100mm | |
Opening method | Top opening | |
Gas control | 1 mass flow meter is used to control the Ar flow, with a range of 200SCCM | |
Vacuum system | Equipped with 1 molecular pump system, gas pumping speed 600L/S | |
Film thickness measurement | Optional quartz crystal film thickness meter, resolution 0.10 Å | |
Sputtering power supply | Equipped with DC power supply, power 500W*2 | |
Control system | CYKY self-developed professional control system | |
Equipment dimensions | 540mm×540mm×1000mm | |
Equipment weight | 145kg |
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