8-inch wafer glue baking machine

8-inch wafer glue baking machine is mainly used in the photolithography process in semiconductor manufacturing. The specific application fields and functions are as follows:

Application fields:

Semiconductor manufacturing: used for baking photoresist to ensure the accuracy of pattern transfer.

Micro-electromechanical system (MEMS): used for curing photoresist in MEMS device manufacturing.

Optoelectronic devices: used for photoresist processing in the manufacturing of lasers, detectors and other devices.

Flat panel display: used for baking photoresist in the manufacturing of liquid crystal and OLED display panels.

Function:

Remove solvent: evaporate the solvent in the photoresist by heating to enhance adhesion.

Improve stability: cure the photoresist and improve its stability in subsequent processes.

Optimize pattern transfer: ensure uniform baking of photoresist and improve pattern transfer accuracy.

Enhance corrosion resistance: improve the corrosion resistance of photoresist in etching and ion implantation.

Main features:

Uniform heating: ensure uniform temperature on the wafer surface.

Precise temperature control: high temperature control accuracy to meet different process requirements.

Efficient production: supports simultaneous processing of multiple wafers to improve efficiency.

Summary: In the photolithography process of semiconductors and related fields, the 8-inch wafer baking machine is mainly used for baking and curing photoresist to ensure the accuracy of pattern transfer and process stability.

Technical parameters of the 8-inch wafer baking machine: