CY-SYJ-150 is a low-speed diamond cutting machine, which equips with the advanced digital micrometer and digital speed display controller, it is the perfect tool for cutting/dicing/slicing all kinds of materials up to 32.5 mm thickness, especially for brittle crystals, ceramics, TEM samples, and even plastic samples. Also this cutting machine can be used for cutting cylindrical cell for failure analysis.
Technical parameters:
Model No. | CY-SYJ-150 |
Working oltage | AC 110V/220V switchable for worldwide usage
110VDC Motor
8Amp fuse installed |
Speed range | 0~600rpm with LED Digital display |
Cutting width & Depth | The cutting width of the slice is controllable from 1mm ~ 24mm by adjusting the LCD digital micrometer. The LCD micrometer is waterproof with a resolution of 0.001 mm and accuracy of +/-0.003 mm.
32.5mm max. cutting depth (when using 35mm Dia. blade flange) |
Diamond blades | Three blades are included for cutting various materials
SiC blade: 4" x 0.35 mm x 0.5" Arbor for cutting nonferrous metal materials, such as superalloys.
Al2O3 blade: 4" x 0.35 mm x 0.5" Arbor for cutting ferrous metal materials, such as iron and steel.
Full sintered diamond blade: 4" x 0.35 mm x 0.5" arbor for cutting crystal, ceramic, and plastic materials |
Sample Holder & Mini-vise | Two angles adjustable sample holder is included, please click picture below for the details (max. opening 26mm)
One Mini-vise is included, which can be easily adapted onto the sample holder to clamp rod shape specimens with a diameter up to 1'' max. |
Package Dimensions | 19"(L) x 15"(W) x 15"(H) |
Shipping Weight & Dimension | 32 lbs, 18" x 14" x 14" |
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