small diamond cutting machine

small diamond cutting machine is suitable for cutting materials with different hardness, such as ceramics, crystals, glass, metals, rocks, thermoelectric materials, infrared optical materials, composite materials and biomedical materials.

1.  CY-DWC-M404 small diamond cutting machine is especially suitable for the cutting of artificial crystal materials such as silicon, sapphire, sapphire, etc. It can be used for special-shaped and slicing processing of brittle and hard materials, such as: sapphire, monocrystalline silicon, polycrystalline silicon, Alumina, ceramics, gem jade and other materials. Especially suitable for special-shaped cutting of graphite electrodes. When used in the slicing of precious gemstones and biological plasticized specimens, not only the slits are small, but also the quality of the cutting pieces is excellent, which greatly improves the utilization rate of materials.

2. The　CY-DWC-M404 small diamond cutting machine can cut continuously. After setting the cutting program, the sample can be continuously fed without manual adjustment. The dimensional accuracy of the cut sample is high, within the range of ±10μm.

3. The cutting line of CY-DWC-M404 small diamond cutting machine adopts a single line reciprocating motion mode, which greatly improves the cutting efficiency. The tensioning wheel force adopts an adjustable adaptive mode, and the tension can be adjusted according to the thickness of the wire diameter. When the center wire diameter is too thin, it can effectively protect the cutting wire from breaking due to excessive tension and prolong the life of the cutting wire.

4. Easy to operate, easy to operate, fast and convenient to change the line

5. Diversity of cutting types, oblique cutting, straight cutting, transverse cutting, multi-directional angle linkage, more flexibility;

6. More intelligent,

7. The motor is directly driven, with low energy consumption, low machine vibration and low noise.

small diamond cutting machine technical parameter: