CY-MP20-2B grinding/polishing machine is equipped with 8" lapping plate and can be used as a standard manual grinder, or lapping/polishing machine for two pieces flat sample and metallographic samples at the same time. It is the most cost effective solution for the material research lab to prepare metallographic samples and failure analysis
Model No. | CY-MP20-2B |
Polishing pad diameter | Φ200mm each |
Polishing rotating speed | 50-1000r/min, stepless adjustable |
Motor | Two 550w high torque DC motor |
Input power | 550w |
Input voltage | AC 220V 50Hz |
Outer dimension | 725*710*310mm |
Gross weight | 50Kg |
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